Glenn Rinne
81Patents
21h-index
53Co-inventors
91Inventor score
Filing activity: Mar 4, 1992 → Feb 12, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5289631A | Method for testing, burn-in, and/or programming of integrated circuit chips | Emerging Cross-Sectional Technologies | 155 | Expired |
| US6492197B1 | Trilayer/bilayer solder bumps and fabrication methods therefor | Electricity | 75 | Expired |
| US5963793A | Microelectronic packaging using arched solder columns | Electricity | 72 | Expired |
| US5892179A | Solder bumps and structures for integrated redistribution routing conductors | Emerging Cross-Sectional Technologies | 57 | Expired |
| US5447264A | Recessed via apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon | Electricity | 51 | Expired |
| US6117299A | Methods of electroplating solder bumps of uniform height on integrated circuit substrates | Electricity | 51 | Expired |
| US6392163B1 | Controlled-shaped solder reservoirs for increasing the volume of solder bumps | Emerging Cross-Sectional Technologies | 47 | Expired |
| US5793116A | Microelectronic packaging using arched solder columns | Electricity | 46 | Expired |
| US6388203B1 | Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby | Emerging Cross-Sectional Technologies | 43 | Expired |
| US6418033B1 | Microelectronic packages in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute angles | Electricity | 43 | Expired |
| US6329608A | Key-shaped solder bumps and under bump metallurgy | Emerging Cross-Sectional Technologies | 42 | Expired |
| US8362612B1 | Semiconductor device and manufacturing method thereof | Electricity | 40 | Active |
| US5990472A | Microelectronic radiation detectors for detecting and emitting radiation signals | Electricity | 37 | Expired |
| US5381946A | Method of forming differing volume solder bumps | Emerging Cross-Sectional Technologies | 35 | Expired |
| US6137623A | Modulatable reflectors and methods for using same | Physics | 34 | Expired |
| US6389691B1 | Methods for forming integrated redistribution routing conductors and solder bumps | Emerging Cross-Sectional Technologies | 33 | Expired |
| US5374893A | Apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon | Emerging Cross-Sectional Technologies | 24 | Expired |
| US6233088A | Methods for modulating a radiation signal | Physics | 23 | Expired |
| US7932615B2 | Electronic devices including solder bumps on compliant dielectric layers | Electricity | 21 | Active |
| US7297631B2 | Methods of forming electronic structures including conductive shunt layers and related structures | Electricity | 21 | Expired |
| US5315485A | Variable size capture pads for multilayer ceramic substrates and connectors therefor | Electricity | 21 | Expired |
| US7427557B2 | Methods of forming bumps using barrier layers as etch masks | Electricity | 17 | Expired |
| US6863209B2 | Low temperature methods of bonding components | Physics | 16 | Expired |
| US6960828B2 | Electronic structures including conductive shunt layers | Electricity | 14 | Expired |
| US6793792B2 | Electroplating methods including maintaining a determined electroplating voltage and related systems | Electricity | 11 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.