Inspection method, apparatus and system for circuit pattern
US6388747B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2001 |
| Grant date | May 14, 2002 |
| Priority date | — |
| Expiry date | Apr 11, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Inspection method, apparatus, and system for a circuit pattern, in which when various conditions which are necessary in case of inspecting a fine circuit pattern by using an image formed by irradiating white light, a laser beam, or a charged particle beam are set, its operating efficiency can be improved. An inspection target region of an inspection-subject substrate is displayed, and a designated map picture plane and an image of an optical microscope or an electron beam microscope of a designated region are displayed in parallel, thereby enabling a defect distribution and a defect image to be simultaneously seen. Item names of inspecting conditions and a picture plane to display, input, or instruct the contents of the inspecting conditions are integrated, those contents are overlapped to the picture plane and layer-displayed, and all of the item names are displayed in parallel in a tab format in the upper portion of the picture plane of the contents. When a desired item name is clicked, the picture plane is switched and the contents corresponding to the clicked item name are displayed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.