Method and apparatus for motion control
US6389702B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | May 12, 2000 |
| Grant date | May 21, 2002 |
| Priority date | — |
| Expiry date | May 12, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An apparatus and method for positioning a wafer holding platform by moving it along a first set of axes concurrently through a path measured along a second set of axes. An apparatus of the present invention comprises a motor system to move the wafer holding stage and a motion control system to control the path of the wafer holding stage. The motor system constrains the wafer holding stage to a first two axes of movement, and the motion control system controls the path along a second two axes of movement. The first two axes and second two axes are located at angles from one another. The distance a wafer on the wafer holding stage is to be moved is measured along the second two axes. A method comprises constraining the movement of a wafer holding stage to a first and a second movement axes and controlling a path of the wafer holding stage along a third and a fourth movement axis. The present invention increases the speed of the wafer holding platform, thereby decreasing the time needed to test a wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.