Wafer container having electrically conductive kinematic coupling groove, support surface with electrically conductive kinematic coupling pin, transportation system, and method

US6389706B1 · kind B1 · utility

Assignee

• Motorola, Inc. · US

Inventors

• Gregor Kuebart · Dresden, DE
• Michael Lering · Bubenreuth, DE
• Sven Hahn · Dresden, DE

Key dates

• Filing date: Aug 17, 2000
• Grant date: May 21, 2002
• Expiry date: Nov 29, 2020

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67259
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A transportation system (100/200) has a wafer container (100), such as a FOUP, to rest on a support surface (200). The container has kinematic coupling grooves, and the support surface has kinematic coupling pins. Grooves and pins are at least partially electrically conductive and allow coupling an electric device (150) associated with the container to an electrical circuit (250) associated with the support surface. Device and circuit in combination allow to perform a variety of functions, such as monitoring the correct position of the container, and exchanging signals.