Wafer container having electrically conductive kinematic coupling groove to detect the presence of the wafer container on a support surface, the support surface, and method
US6389707B1 · kind B1 · utility
7Cited by
8References
11Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 17, 2000 |
| Grant date | May 21, 2002 |
| Priority date | — |
| Expiry date | Nov 29, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67259
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a transportation system (100, 200) for wafers, a wafer container (100) has kinematic coupling grooves, and a support surface (200) has kinematic coupling pins. Grooves and pins are at least partially electrically conductive to allow monitoring the correct position of the container by measuring electrical resistance, as well as to allow signal exchange to and from the container (100). The kinematic coupling pins have first and second surface areas that are electrically isolated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.