Method for removing particles from surface of article
US6391118B1 · kind B1 · utility
7Cited by
20References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 2001 |
| Grant date | May 21, 2002 |
| Priority date | — |
| Expiry date | May 1, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and an apparatus for removing particles from a surface of an article, such as a semiconductor wafer in a clean room. The particles are supplied with an electric charge. Subsequently, an ultrasonic wave or a gas stream is applied onto the surface of the article while an electric field is applied for driving away the electrically charged particles from the surface, thereby removing particles having a dimension smaller than 1 micrometer from the surface. The presence of a collecting member allows the removal of resulting, floating particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.