Manufacture of void-free laminates and use thereof
US6391436B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 1999 |
| Grant date | May 21, 2002 |
| Priority date | — |
| Expiry date | May 20, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249947
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention provides a method of forming a void-free laminate, comprising the steps of:(a) enclosing a partially impregnated prepreg in a vacuum envelope, said partially impregnated prepreg comprising a fiber layer partially impregnated with a resin composition; and(b) heating said partially impregnated prepreg under vacuum to withdraw air present in said partially impregnated prepreg and to cause said resin composition (i) to fully infuse into said fiber layer and (ii) to cure thereby forming said void-free laminate.The present invention further provides novel combinations of modified epoxy resins that may be employed with the methods disclosed. The void-free laminates may be utilized for the manufacture of parts for the aerospace and aircraft industries.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.