Fabrication process for microstructure protection systems related to hard disk reading unit
US6391741B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2000 |
| Grant date | May 21, 2002 |
| Priority date | — |
| Expiry date | Jul 14, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for assembling a microactuator on a R/W transducer that includes forming a first wafer of semiconductor material having a plurality of microactuators including suspended regions and fixed regions separated from each other by first trenches; forming a second wafer of semiconductor material comprising blocking regions connecting mobile and fixed intermediate regions separated from each other by second trenches; bonding the two wafers so as to form a composite wafer wherein the suspended regions of the first wafer are connected to the mobile intermediate regions of the second wafer, and the fixed regions of the first wafer are connected to the fixed intermediate regions of the second wafer; cutting the composite wafer into a plurality of units; fixing the mobile intermediate region of each unit to a respective R/W transducer; and removing the blocking regions. The blocking regions are made of silicon oxide, and the intermediate regions are made of polycrystalline silicon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.