Inventor · Pietrapertosa, IT

Benedetto Vigna

91Patents
17h-index
55Co-inventors
87Inventor score

Filing activity: Jul 30, 1997 → Dec 7, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US6405592B1 Hermetically-sealed sensor with a movable microstructure Physics 60 Expired
US6508124B1 Microelectromechanical structure insensitive to mechanical stresses Performing Operations; Transporting 55 Expired
US8433084B2 Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof Electricity 45 Active
US6869856B2 Process for manufacturing a semiconductor wafer integrating electronic devices including a structure for electromagnetic decoupling Electricity 40 Expired
US8049287B2 Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device Electricity 36 Active
US6501623B1 Method for assembling an actuator device for a hard disk, comprising a read/write transducer, a microactuator, and a suspension, and the actuator device thus obtained Physics 30 Expired
US5883009A Method of fabricating integrated semiconductor devices comprising a chemoresistive gas microsensor Electricity 28 Expired
US8173513B2 Method for manufacturing a semiconductor pressure sensor Physics 28 Active
US6370954B1 Semiconductor integrated inertial sensor with calibration microactuator Physics 24 Expired
US7252002B2 Planar inertial sensor, in particular for portable devices having a stand-by function Electricity 22 Expired
US6587312B2 Structure for electrically connecting microelectromechanical devices, in particular microactuators for hard disk drivers Electricity 22 Expired
US6605873B1 Integrated electronic device comprising a mechanical stress protection structure Electricity 21 Expired
US6472244B1 Manufacturing method and integrated microstructures of semiconductor material and integrated piezoresistive pressure sensor having a diaphragm of polycrystalline semiconductor material Performing Operations; Transporting 21 Expired
US6469330B1 Process for manufacturing integrated devices comprising microstructures and associated suspended electrical interconnections Electricity 20 Expired
US7793544B2 Microelectromechanical inertial sensor, in particular for free-fall detection applications Physics 19 Active
US6198145A Method for manufacturing a semiconductor material integrated microactuator, in particular for a hard disc mobile read/write head, and a microactuator obtained thereby Electricity 19 Expired
US6209394A Integrated angular speed sensor device and production method thereof Electricity 18 Expired
US6072665A Suspension arm for a head of a disk storage device Physics 17 Expired
US6331444A Method for manufacturing integrated devices including electromechanical microstructures, without residual stress Physics 17 Expired
US6624981B1 Micrometric actuation, hard disk read/write unit with a flexure and microactuator formed in a monolithic body of semiconductor material Emerging Cross-Sectional Technologies 16 Expired
US6090638A Process for manufacturing high-sensitivity capacitive and resonant integrated sensors, particularly accelerometers and gyroscopes, and sensors made therefrom Physics 16 Expired
US7022542B2 Manufacturing method of a microelectromechanical switch Electricity 15 Expired
US7520171B2 Micro-electromechanical structure with self-compensation of the thermal drifts caused by thermomechanical stress Physics 15 Active
US6051854A Integrated semiconductor device comprising a chemoresistive gas microsensor and manufacturing process thereof Physics 15 Expired
US6387725B1 Production method for integrated angular speed sensor device Electricity 15 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.