Patent · US Expired

Method and apparatus for producing photoelectric conversion device

US6391743B1 · kind B1 · utility

38Cited by
11References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 22, 1999
Grant dateMay 21, 2002
Priority date
Expiry dateSep 22, 2019

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02E10/50
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

There is disclosed a method of producing a photoelectric conversion device comprising the steps of forming a semiconductor substrate comprising a first and a second semiconductor layers with a separation layer therebetween; bonding a support substrate to a surface of the second semiconductor layer opposite to the separation-layer-side surface to form a bonded substrate; separating the first and the second semiconductor layers by the separation layer; and producing a photoelectric conversion device in the second semiconductor layer, wherein when bonding the semiconductor substrate and the support substrate to each other, at least a portion is formed in the bonded substrate in which at least a part of end portions of the semiconductor substrate and the support substrate is not bonded to the other substrate and a fluid is jetted against a side surface of the bonded substrate, thereby separating the first and the second semiconductor layers. The method makes it possible to separate a bonded substrate with a high yield, thereby supplying photoelectric conversion devices with a high quality at a low production cost.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.