Porous materials
US6391932B1 · kind B1 · utility
81Cited by
6References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2000 |
| Grant date | May 21, 2002 |
| Priority date | — |
| Expiry date | Aug 8, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0212
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Porous polyimide dielectric materials having low dielectric constants useful in electronic component manufacture are disclosed along with methods of preparing the porous polyimide dielectric materials. Also disclosed are methods of forming integrated circuits containing such porous polyimide dielectric material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.