Structure equipped with electric contacts formed through said structure substrate and method for obtaining said structure
US6392158B1 · kind B1 · utility
28Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2000 |
| Grant date | May 21, 2002 |
| Priority date | — |
| Expiry date | Aug 8, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A stack including a micro-system having an electrical contact to connect the micro-system to the outside world, a substrate having a first layer formed on the substrate, a through hole extending in an axial direction of the substrate and configured to reveal a rear side of the first layer and to provide a passage to electrically connect to the electrical contact, and a cavity located at an end of the through hole close to the first layer, wherein the cavity has dimensions transverse to the axial direction larger than a diameter of the through hole and forms an overhanging edge around the through hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.