Semiconductor chip packaging system and a semiconductor chip packaging method using the same
US6392286B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2000 |
| Grant date | May 21, 2002 |
| Priority date | — |
| Expiry date | Aug 2, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention uses an ultraviolet ray to clean PCBs in packaging semiconductors, instead of using a plasma gas. Since the ultraviolet ray cleaning does not require a vacuum condition around an ultraviolet ray lamp, a guide belt for conveying the PCBs can be freely installed in such a manner that an ultraviolet ray cleaning tool and fabricating equipment are arranged in-line. This results in an in-line arrangement of an ultraviolet ray cleaning chamber and the fabricating equipment. Therefore, the PCBs can be introduced into fabricating processes immediately after cleaning and a long standby time problem of the PCB outside of the fabricating equipment is solved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.