Testing electronic devices
US6392427B1 · kind B1 · utility
71Cited by
21References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 21, 1998 |
| Grant date | May 21, 2002 |
| Priority date | — |
| Expiry date | Dec 21, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/97
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test assembly contains a plurality of electronic devices that are attached to a lead frame. Leads of the electronic devices are trimmed from the lead frame to electrically isolate the leads. At least a portion of the lead frame is mounted into a socket in the test assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.