High speed semiconductor optical modulator and fabricating method thereof
US6392781B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2000 |
| Grant date | May 21, 2002 |
| Priority date | — |
| Expiry date | Feb 4, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB82Y20/00
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The present invention relates to an electrical field absorbing semiconductor optical modulator, more particularly, to a high speed semiconductor optical modulator and a fabricating method thereof. The present invention includes a high speed semiconductor optical modulator, the optical modulator formed by stacking an n-type light-wave guiding layer, a light absorbing layer, a p-type light-wave guiding layer, a p-type clad layer, and a p-type ohmic contact layer on a substrate successively, the optical modulator having a ridge structure wherein the optical modulator is an electric-field absorbing type, and wherein width W3 of the light absorbing layer is less than the width W1 of the p-type ohmic contact layer. Accordingly, the present invention enables to provide high speed optical modulation of tens of giga rate of which modulating characteristics are excellent by reducing contact resistance and capacitance, which are the major problems of ruining the characteristics of an optical modulator, simultaneously.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.