Method and device for thermally bonding connecting surfaces of two substrates
US6394158B1 · kind B1 · utility
26Cited by
5References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 14, 2000 |
| Grant date | May 28, 2002 |
| Priority date | — |
| Expiry date | Jul 14, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for the thermal connection of overlapping connecting surfaces (19, 20) of two substrates (17, 18), at least one substrate (18) being 5 transparent and laser energy being applied to the connecting surfaces (19, 20) from a rear side (26) of the transparent substrate (18), laser energy being applied separately to each of the contact pairs (37) constructed between two connecting surfaces (19, 20) of the opposing substrates (17, 18).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.