Micromechanical component and appropriate manufacturing method

US6395574B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Hubert Benzel · Neckartenzlingen, DE
• Frank Schaefer · Lörrach, DE
• Heinz-Georg Vossenberg · Pfullingen, DE

Key dates

• Filing date: May 16, 2001
• Grant date: May 28, 2002
• Expiry date: May 16, 2021

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81B2201/0264
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A micromechanical component, particularly a pressure sensor, includes a substrate, made of semiconductor material; a functional layer provided epitactically on substrate; a hollow space being provided between substrate and functional layer defining a diaphragm region of functional layer; and below diaphragm region, on substrate, one or more spacers being provided, for preventing adhesion of diaphragm region to substrate during deformation. Also described is an appropriate manufacturing method.