Hubert Benzel
73Patents
9h-index
71Co-inventors
81Inventor score
Filing activity: Jun 1, 1994 → Feb 5, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5792957A | Capacitive pressure sensors with high linearity by optimizing electrode boundaries | Physics | 46 | Expired |
| US6803637B2 | Micromechanical component with different doping types so that one type is anodized into porous silicon | Performing Operations; Transporting | 24 | Expired |
| US7354786B2 | Sensor element with trenched cavity | Performing Operations; Transporting | 16 | Active |
| US6062088A | Pressure sensor | Physics | 13 | Expired |
| US7300854B2 | Method for producing a semiconductor component having a movable mass in particular, and semiconductor component produced according to this method | Emerging Cross-Sectional Technologies | 11 | Expired |
| US7037438B2 | Method for production of a semiconductor component and a semiconductor component produced by said method | Performing Operations; Transporting | 10 | Expired |
| US7555956B2 | Micromechanical device having two sensor patterns | Physics | 10 | Active |
| US8470631B2 | Method for manufacturing capped MEMS components | Electricity | 9 | Active |
| US5445031A | Pressure-measuring arrangement with high linearity | Physics | 9 | Expired |
| US7918136B2 | Micromechanical sensor element | Physics | 8 | Active |
| US6906392B2 | Micromechanical component | Performing Operations; Transporting | 8 | Expired |
| US7045382B2 | Method for producing micromechanic sensors and sensors produced by said method | Performing Operations; Transporting | 8 | Expired |
| US7213465B2 | Micromechanical sensor | Electricity | 7 | Expired |
| US7093493B2 | Pressure sensor having a silicon chip on a steel diaphragm | Physics | 7 | Expired |
| US9926188B2 | Sensor unit including a decoupling structure and manufacturing method therefor | Electricity | 7 | Active |
| US6840111B2 | Micromechanical component and pressure sensor having a component of this type | Physics | 7 | Expired |
| US7563634B2 | Method for mounting semiconductor chips, and corresponding semiconductor chip system | Electricity | 6 | Expired |
| US7160750B2 | Method of producing a semiconductor sensor component | Performing Operations; Transporting | 6 | Expired |
| US7833405B2 | Micromechanical component and corresponding production method | Performing Operations; Transporting | 6 | Expired |
| US7055392B2 | Micromechanical pressure sensor | Physics | 5 | Expired |
| US7193290B2 | Semiconductor component and a method for producing the same | Physics | 5 | Expired |
| US6832523B2 | Micromechanical component and manufacturing method | Electricity | 5 | Expired |
| US6395574B2 | Micromechanical component and appropriate manufacturing method | Performing Operations; Transporting | 4 | Expired |
| US8429977B2 | Micromechanical pressure-sensor element and method for its production | Emerging Cross-Sectional Technologies | 4 | Active |
| US8485041B2 | Sensor system, method for operating a sensor system, and method for manufacturing a sensor system | Physics | 4 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.