Method for improving the liquid dispensing of IC packages
US6395584B2 · kind B2 · utility
3Cited by
11References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2000 |
| Grant date | May 28, 2002 |
| Priority date | — |
| Expiry date | Dec 26, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49172
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flat plate mold with special treatment or a metallic flat plate mold is adopted to flatten the resin painted over on IC chips during package dispensing process, such that it is able to maintain a consistent flatness of the surface of IC products after dispensing for laser or ink marking. And heat sinks can be attached to the flat plate mold to increase the heat-dissipating rate of IC products after dispensing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.