Inventor · Hsinchu, TW

Chi-Hsing Hsu

56Patents
10h-index
27Co-inventors
78Inventor score

Filing activity: Dec 26, 2000 → Feb 13, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US7224062B2 Chip package with embedded panel-shaped component Electricity 79 Expired
US6861740B2 Flip-chip die and flip-chip package substrate Electricity 74 Expired
US6809262B1 Flip chip package carrier Electricity 73 Expired
US6882057B2 Quad flat no-lead chip carrier Electricity 64 Expired
US7129568B2 Chip package and electrical connection structure between chip and substrate Electricity 22 Expired
US7038309B2 Chip package structure with glass substrate Electricity 22 Expired
US6596560B1 Method of making wafer level packaging and chip structure Electricity 19 Expired
US8054639B2 Image-sensing module for reducing overall thickness thereof and preventing EMI Electricity 16 Active
US7365418B2 Multi-chip structure Electricity 10 Active
US7547965B2 Package and package module of the package Electricity 10 Active
US11031395B2 Method of forming high performance MOSFETs having varying channel structures Electricity 9 Active
US6740965B2 Flip-chip package substrate Electricity 9 Expired
US7193324B2 Circuit structure of package substrate Electricity 9 Expired
US7470864B2 Multi-conducting through hole structure Electricity 8 Active
US7230332B2 Chip package with embedded component Electricity 8 Expired
US7378601B2 Signal transmission structure and circuit substrate thereof Electricity 7 Expired
US7608923B2 Electronic device with flexible heat spreader Electricity 7 Active
US7129146B2 Flip chip package and process of forming the same Electricity 7 Expired
US8519428B2 Vertical stacked light emitting structure Electricity 6 Active
US6643136B2 Multi-chip package with embedded cooling element Electricity 5 Expired
US7291916B2 Signal transmission structure and circuit substrate thereof Electricity 4 Expired
US6710459B2 Flip-chip die for joining with a flip-chip substrate Electricity 3 Expired
US6774498B2 Flip-chip package substrate Electricity 3 Expired
US6395584B2 Method for improving the liquid dispensing of IC packages Emerging Cross-Sectional Technologies 3 Expired
US7053638B2 Surrounding structure for a probe card Physics 3 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.