Manufacturing process of semiconductor devices
US6395622B1 · kind B1 · utility
9Cited by
8References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2001 |
| Grant date | May 28, 2002 |
| Priority date | — |
| Expiry date | Jun 5, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A manufacturing process of semiconductor devices comprises providing at least a wafer, bumping the wafer, testing the wafer, laser repairing, and dicing. The step of testing one bumped wafer is contained after bumping and before laser repairing in order to shorten the procedures and increase throughput
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.