Self-heating circuit board
US6396706B1 · kind B1 · utility
48Cited by
7References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 30, 1999 |
| Grant date | May 28, 2002 |
| Priority date | — |
| Expiry date | Jul 30, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Separate heating elements are embedded in a printed circuit board near integrated circuit (IC) packages or other parts mounted on the circuit board. Each heating element supplies heat to the part residing near it in response to an input voltage pulse. The heating elements are used to selectively melt solder or adhesives attaching the parts to the circuit board so that they can be easily removed or to temporarily melt solder or cure adhesive when the parts are mounted on the circuit board. The heating elements are also used to supply heat to IC packages for regulating their operating temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.