Method and apparatus for localized liquid treatment of the surface of a substrate
US6398975B1 · kind B1 · utility
91Cited by
5References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2000 |
| Grant date | Jun 4, 2002 |
| Priority date | — |
| Expiry date | Apr 20, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for dispensing a liquid on the surface of a localized zone of a substrate, for example for cleaning of etching purposes. Along with the liquid, a gaseous tensio-active substance is supplied, which is miscible with said liquid and when mixed with the liquid, reduces the surface tension of said liquid, thus containing the liquid in a local zone of the substrate surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.