Decorative tape adhesive molding
US6399168B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1999 |
| Grant date | Jun 4, 2002 |
| Priority date | — |
| Expiry date | Nov 12, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31913
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
A decorative tape adhesive molding in which a decorative tape are integrally fusion-bonded to a molding body. A molding body forming material is a non-polar TPE composition, the decorative tape is constituted by a transparent film layer, a backing layer, and a decorative portion layer interposed therebetween. The backing layer forming material is a resin composition containing the same kind of resin polymer as a hard phase-forming polymer of the non-polar TPE or containing a resin polymer having a melting point of not lower than 100° C. and capable of being fusion-bonded to the hard phase-forming polymer of the non-polar TPE.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.