Aqueous cleaning solution for removing contaminants surface of circuit substrate cleaning method using the same
US6399552B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 1999 |
| Grant date | Jun 4, 2002 |
| Priority date | — |
| Expiry date | Dec 1, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A cleaning solution for removing contaminants from the surface of an integrated circuit substrate includes a fluoride reducing agent, an organic acid containing a carboxyl group, an alkaline pH controller and water. The pH of the cleaning solution is 3.5-8.8. The cleaning solution is used at a low temperature, such as room temperature, which is lower than that for conventional cleaning solutions. Therefore, the cleaning solution does not evaporate. Furthermore, a cleaning method using the cleaning solution does not require a pre-ashing step to reinforce the cleaning agent, nor is an alcohol rinse step required. The cleaning solution is removed by rinsing with deionized water. Therefore, the cleaning method using the cleaning solution is quicker and less costly than conventional cleaning methods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.