Multilayer boards
US6399891B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2000 |
| Grant date | Jun 4, 2002 |
| Priority date | — |
| Expiry date | Jun 15, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10378
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer board free from breakage at connecting parts due to thermal fatigue is provided. A multilayer board 1 of the present invention comprises alternating polyimide films 11-16 and copper films 21-26. The polyimide films 11-16 have a thermal expansion coefficient of 2-5 ppm/° C. so that the multilayer board 1 has a total thermal expansion coefficient of less than 10 ppm/° C. Because of the thermal expansion coefficient close to that of the semiconductor element to be mounted, no breakage occurs at connecting parts to the semiconductor element. The multilayer board 1 of the present invention may be used as both interposer and motherboard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.