Aggregate of semiconductor devices including semiconductor packages arranged on a first tape and wound on a reel and also including a spacer tape provided with spacers
US6400020B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 25, 2000 |
| Grant date | Jun 4, 2002 |
| Priority date | — |
| Expiry date | Apr 25, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/5142
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An aggregate of semiconductor devices, including semiconductor packages packaging the semiconductor devices, the packages being on a tape which is wound on a reel, is provided. The aggregate of semiconductor devices includes the semiconductor packages arranged consecutively on a first tape; and the aggregate also includes a second tape, which is a spacer tape, having spacers (protrusions), provided between adjacent windings of the first tape on the reel, providing spaces for the semiconductor packages. The semiconductor packages can be provided with bumps, e.g., on the side of the first tape opposite the side of the first tape having the semiconductor packages thereon, and the first tape can be a flexible printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.