Ryosuke Kimoto
25Patents
11h-index
45Co-inventors
71Inventor score
Filing activity: Dec 14, 1992 → Jul 25, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5714405A | Semiconductor device | Emerging Cross-Sectional Technologies | 70 | Expired |
| US6879041B2 | Semiconductor device with joint structure having lead-free solder layer over nickel layer | Electricity | 56 | Expired |
| US5583375A | Semiconductor device with lead structure within the planar area of the device | Emerging Cross-Sectional Technologies | 48 | Expired |
| US6476467B2 | Semiconductor device and process for producing the same | Electricity | 37 | Expired |
| US6521981B2 | Semiconductor device and manufacturing method thereof | Emerging Cross-Sectional Technologies | 30 | Expired |
| US7420284B2 | Semiconductor device and manufacturing method thereof | Electricity | 29 | Active |
| US6342726B2 | Semiconductor device and manufacturing method thereof | Emerging Cross-Sectional Technologies | 23 | Expired |
| US6670215B2 | Semiconductor device and manufacturing method thereof | Emerging Cross-Sectional Technologies | 18 | Expired |
| US6342728B2 | Semiconductor device and manufacturing method thereof | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6472727B2 | Semiconductor device and manufacturing method thereof | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6060770A | Semiconductor device and process for producing the same | Electricity | 14 | Expired |
| US6278176A | Semiconductor device and process for producing the same | Electricity | 11 | Expired |
| US6642083B2 | Semiconductor device and manufacturing method thereof | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6365439B2 | Method of manufacturing a ball grid array type semiconductor package | Emerging Cross-Sectional Technologies | 10 | Expired |
| US7091620B2 | Semiconductor device and manufacturing method thereof | Electricity | 8 | Expired |
| US7332800B2 | Semiconductor device | Electricity | 7 | Expired |
| US6355500B2 | Semiconductor device and manufacturing method thereof | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6146920A | Bump formation method | Emerging Cross-Sectional Technologies | 6 | Expired |
| US7217645B2 | Method for manufacturing semiconductor device and electronic device and method for calculating connection condition | Electricity | 4 | Expired |
| US5869888A | Semiconductor device with lead structure on principal surface of chip | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6664135B2 | Method of manufacturing a ball grid array type semiconductor package | Emerging Cross-Sectional Technologies | 3 | Expired |
| US7211892B2 | Semiconductor device having a particular electrode structure | Electricity | 3 | Expired |
| US6355975B2 | Semiconductor device and manufacturing method thereof | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6353255B2 | Semiconductor device and manufacturing method thereof | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6400020B1 | Aggregate of semiconductor devices including semiconductor packages arranged on a first tape and wound on a reel and also including a spacer tape provided with spacers | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.