Method of forming bumps
US6402014B1 · kind B1 · utility
8Cited by
14References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2000 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Oct 13, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0557
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to form, there are various limitations to the material of which the bumps are made, to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.