Planarization system for chemical-mechanical polishing
US6402591B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 31, 2000 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Mar 31, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/11
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for performing and an apparatus to perform chemical mechanical polishing on a semiconductor wafer are disclosed. The apparatus includes a wafer holder, a polishing member, and a movable table. The movable table is in contact with and is supporting the polishing member. The polishing member includes a polishing pad, a backing layer, and a stiffening layer positioned between the backing layer and the polishing pad. The polishing pad has a polishing surface that is oriented to receive a semiconductor wafer held by the wafer holder. The polishing surface is configured to chemically mechanically polish the semiconductor wafer. The method includes holding a semiconductor wafer, moving a polishing member, and bringing a surface of the semiconductor wafer into contact with the polishing member. The polishing member includes a polishing pad, a backing layer, and a stiffening layer positioned between the polishing pad and the backing layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.