Method and apparatus for electrochemical mechanical deposition
US6402925B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 14, 2000 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Dec 14, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer and thereafter electropolishes the wafer. The steps that are used when making this application include applying the conductive material to the predetermined area of the wafer using an electrolyte solution disposed on a surface of the wafer, when the wafer is disposed between a cathode and an anode, and preventing accumulation of the conductive material to areas other than the predetermined area by mechanically polishing the other areas while conductive material is being applied. Thereafter, electropolishing of the previously applied conductive material takes place by applying a second potential difference having a polarity opposite the first potential difference that was used when applying the conductive material. While applying the second potential difference, polishing of the conductive layer with the previously accumulated conductive material disposed thereover is performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.