Plated material for connectors
US6403234B1 · kind B1 · utility
13Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2000 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Jun 14, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1291
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A plated material for connectors, having superior insertion and withdrawal properties, comprises an intermediate layer consisting of Ni alloy plating having a Vickers hardness of 450 to 750 Hv and a thickness of 0.3 to 2 &mgr;m provided on a base metal consisting of Cu or Cu alloy, a reflowed Sn or Sn alloy plated surface layer provided thereon, and an alloy layer consisting primarily of Sn—Ni and having a thickness of 0.05 to 2 &mgr;m formed by diffusion between the intermediate layer and the surface layer, in which average grain size of said Sn—Ni compound is 0.05 to 1 &mgr;m.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.