Cross-shaped resist dispensing system and method
US6403500B1 · kind B1 · utility
3Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2001 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Jan 12, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An exemplary method of depositing photoresist material on an integrated circuit wafer is described. This method can include providing a cross-shaped resist dispenser including a plurality of resist dispense nozzles; dispensing photoresist material through the plurality of resist dispense nozzles to an integrated circuit wafer; and rotating at least one of the cross-shaped resist dispenser and the integrated circuit wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.