Coated means for connecting a chip and a card
US6403892B1 · kind B1 · utility
3Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 1996 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Jun 24, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flex or TAB product suitable for chip carrier applications wherein the flex reliability problems caused by copper dendrite growth and lead bending during power and thermal cycling are reduced by application of special coatings to lead areas of the flex tape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.