Semiconductor device, manufacturing method thereof and mounting board
US6404049B1 · kind B1 · utility
30Cited by
3References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 1998 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | May 26, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device in which a semiconductor chip 1 is bonded by a metal bond 2 to one surface of a heat sink 4 formed of a material with a thermal expansion coefficient is close to the semiconductor chip 1, the heat sink 4 is glued to a stiffener with a silicon adhesive 5 with an elastic modulus of 10 MPa or less, a TAB tape 9 is glued to the stiffener 3 with an epoxy adhesive 6, and the semiconductor chip 1 is sealed with an epoxy sealing resin 8 with an elastic modulus of 10 GPa or more for protection from outside.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.