Ryo Haruta
23Patents
10h-index
43Co-inventors
75Inventor score
Filing activity: Jun 16, 1983 → Jul 3, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5336638A | Process for manufacturing semiconductor devices | Emerging Cross-Sectional Technologies | 115 | Expired |
| US6232650A | Semiconductor device having a chip mounted on a flexible substrate with separated insulation layers to prevent short-circuiting | Electricity | 59 | Expired |
| US6476467B2 | Semiconductor device and process for producing the same | Electricity | 37 | Expired |
| US6404049B1 | Semiconductor device, manufacturing method thereof and mounting board | Electricity | 30 | Expired |
| US6897570B2 | Semiconductor device and method of manufacturing same | Electricity | 29 | Expired |
| US5140272A | Method of semiconductor surface measurment and an apparatus for realizing the same | Physics | 23 | Expired |
| US6340793B1 | Semiconductor device | Electricity | 17 | Expired |
| US6060770A | Semiconductor device and process for producing the same | Electricity | 14 | Expired |
| US6512176B2 | Semiconductor device | Electricity | 11 | Expired |
| US6278176A | Semiconductor device and process for producing the same | Electricity | 11 | Expired |
| US6764878B2 | Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate | Electricity | 10 | Expired |
| US6621160B2 | Semiconductor device and mounting board | Electricity | 9 | Expired |
| US4570175A | Three-dimensional semiconductor device with thin film monocrystalline member contacting substrate at a plurality of locations | Electricity | 8 | Expired |
| US6120301A | Semiconductor device and method of manufacturing the same | Electricity | 7 | Expired |
| US6465876B1 | Semiconductor device and lead frame therefor | Electricity | 7 | Expired |
| US6563212B2 | Semiconductor device | Electricity | 5 | Expired |
| US6437428B1 | Ball grid array type semiconductor package having a flexible substrate | Electricity | 4 | Expired |
| US6590275B2 | Ball grid array type semiconductor package having a flexible substrate | Electricity | 4 | Expired |
| US6887739B2 | Method of manufacturing semiconductor package including forming a resin sealing member | Electricity | 2 | Expired |
| US6476466B2 | Ball grid array type semiconductor package having a flexible substrate | Electricity | 2 | Expired |
| US6448111B1 | Method of manufacturing a semiconductor device | Electricity | 2 | Expired |
| US6844219B2 | Semiconductor device and lead frame therefor | Electricity | 1 | Expired |
| US6759279B2 | Method of manufacturing semiconductor device having resin sealing body | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.