Multi-layer flexible printed wiring board
US6404052B1 · kind B1 · utility
15Cited by
10References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2000 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Jul 7, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09563
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layer substrate whose thickness is not increased even if a semiconductor package is mounted, having a semiconductor device buried inside and a shield section capable of being connected to a ground potential to prevent noise from penetrating into the semiconductor device, whose thickness is not increased even if a semiconductor package is mounted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.