Semiconductor device
US6404070B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2000 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Jul 28, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device having a heat dissipation plate which is lighter in weight and smaller in thickness than the conventional metal plate while ensuring a good thermal dissipation and mechanical support, which comprises: a semiconductor chip having a back surface bonded to a lower surface of a heat dissipation plate having an area larger than that of the semiconductor chip; a wiring board composed of a substrate having an upper surface with conductor patterns formed thereon, the conductor patterns having first ends connected to external connection terminals downwardly penetrating through the substrate via through holes extending through the substrate, the external connection terminals being disposed between a periphery of the semiconductor chip and a periphery of the wiring substrate; the semiconductor chip and the wiring board being bonded to each other so that electrode terminals formed on an active surface of the semiconductor chip are electrically connected to second ends of the conductor patterns; and the heat dissipation plate being composed of a fabric of carbon fibers and a resin impregnated in the fabric.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.