Printed circuit board assembly with improved bypass decoupling for BGA packages
US6404649B1 · kind B1 · utility
26Cited by
16References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2000 |
| Grant date | Jun 11, 2002 |
| Priority date | — |
| Expiry date | Mar 3, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board assembly with improved bypass decoupling for BGA packages. In one embodiment, a capacitor may be interposed between a BGA package and a PCB within a perimeter of the contact pads that form a BGA footprint. The capacitor may have physical dimensions which allow a BGA package to be mounted such that there is no physical contact between the capacitor and the BGA.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.