Hermetically-sealed sensor with a movable microstructure
US6405592B1 · kind B1 · utility
60Cited by
14References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 19, 1998 |
| Grant date | Jun 18, 2002 |
| Priority date | — |
| Expiry date | Jun 19, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P15/0802
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor with a movable microstructure including a sensitive element, formed in a first chip of semiconductor material for producing an electrical signal dependent on a movement of at least one movable microstructure relative to a surface of the first chip. The sensitive element is enclosed in a hollow hermetic structure, and circuitry for processing the electrical signal is formed in a second chip of semiconductor material. The hollow hermetic structure includes a metal wall disposed on the surface of the first chip around the sensitive element, and the second chip is fixed to the metal wall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.