Method and apparatus for cleaning a surface of a microelectronic substrate
US6406358B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 1999 |
| Grant date | Jun 18, 2002 |
| Priority date | — |
| Expiry date | Aug 5, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B1/36
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method and apparatus for cleaning a surface of a microelectronic substrate. In one embodiment, the apparatus can include a support member having a manifold in fluid communication with a source of liquid and in fluid communication with at least one exit aperture. A porous brush member can be coupled to the support member such that a contact portion of the brush is positioned against the exit aperture to receive liquid directly from the exit aperture. The liquid can flow from the exit aperture through the contact member and to the surface of the microelectronic substrate to keep the contact portion moist. The contact portion can be moistened as it cleans the microelectronic substrate or between cleaning cycles. The liquid can also be supplied to the contact portion at a rate sufficient to remove particulates and other contaminants from a porous outer surface of the contact portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.