Process for reclaiming wafer substrates
US6406923B1 · kind B1 · utility
17Cited by
7References
7Claims
0Family size
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Inventors
Key dates
| Filing date | Jul 31, 2000 |
| Grant date | Jun 18, 2002 |
| Priority date | — |
| Expiry date | Jul 31, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32135
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process capable of reclaiming used semiconductor wafers with a reduced metallic contamination level on wafer surfaces. The process comprises the steps of removing one or more surface layers of the substrate by chemical etching; scraping off one surface of the substrate in small amount by mechanical machining; removing a damage layer, which has occurred due to the mechanical machining, by chemical etching; and polishing the other surface of the substrate into a mirror finish.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.