Low dielectric constant insulating films with laminated carbon-containing silicon oxide and organic layers
US6407011B1 · kind B1 · utility
38Cited by
9References
11Claims
0Family size
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Key dates
| Filing date | Jul 26, 2000 |
| Grant date | Jun 18, 2002 |
| Priority date | — |
| Expiry date | Jul 26, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02282
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A stacked insulating film having an organic insulating film, and a carbon-containing silicon oxide film formed on the organic insulating film is disclosed. The carbon-containing silicon oxide film has a carbon content of 8 atom % to 25 atom %.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.