Led lead frame assembly
US6407411B1 · kind B1 · utility
101Cited by
17References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2000 |
| Grant date | Jun 18, 2002 |
| Priority date | — |
| Expiry date | Apr 13, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8585
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved LED lead frame packaging assembly includes a thermally conducting, electrically insulating material that enhances the thermal conduction and structural integrity of the assembly, a UV-resistant encapsulantmaterial, and an integral ESD material that reduces electrostatic discharge. The thermally conducting, electrically insulating material creates an electrically insulating, thermally conductive path in the lead frame assembly for dissipation of power and also acts as a mounting structure thus allowing for the use of a soft encapsulant material, preferably a silicone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.