Heat sink to semiconductor module assembly equipment and method
US6408507B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 17, 2000 |
| Grant date | Jun 25, 2002 |
| Priority date | — |
| Expiry date | Dec 13, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/5142
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Automated equipment mounts heat sinks on printed circuit boards. First heat sinks, semiconductor modules and second heat sinks are consecutively seated on a plurality of built-up pads as the built-up pads move from station to station around a built-up pad conveyer. Rivets are mounted in a first heat sink and inserted through holes in a semiconductor module and a second heat sink when seating the semiconductor module and the second heat sink. Working the rivets fixes the first heat sink, the semiconductor module and the second heat sink permanently, and thereby forms a semiconductor product. After that, a label is attached on the semiconductor product and the riveting quality and the labeling quality of the semiconductor product are inspected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.