Seok Goh
9Patents
3h-index
27Co-inventors
53Inventor score
Filing activity: Dec 6, 1999 → May 20, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7485955B2 | Semiconductor package having step type die and method for manufacturing the same | Electricity | 21 | Expired |
| US8546938B2 | Stacked package including spacers and method of manufacturing the same | Electricity | 7 | Active |
| US8564317B2 | Test socket, and test apparatus with test socket to control a temperature of an object to be tested | Physics | 3 | Active |
| US6698486B2 | Apparatus for removing wafer ring tape | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6343503B1 | Module appearance inspection apparatus | Electricity | 2 | Expired |
| US6408507B1 | Heat sink to semiconductor module assembly equipment and method | Emerging Cross-Sectional Technologies | 2 | Expired |
| US9815921B2 | Construct for promoting absorption of molecules by a cell and methods of using the construct | Emerging Cross-Sectional Technologies | 0 | Active |
| US9955687B2 | Polymeric film surface | Emerging Cross-Sectional Technologies | 0 | Active |
| US9130011B2 | Apparatus for mounting semiconductor device | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.