Method and apparatus for conditioning a polish pad at the point of polish and for dispensing slurry at the point of polish
US6409579B1 · kind B1 · utility
4Cited by
10References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2000 |
| Grant date | Jun 25, 2002 |
| Priority date | — |
| Expiry date | May 31, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S451/91
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of conditioning a polish pad at the point of polish and for dispensing slurry at the point of polish. In one embodiment, the method comprises several steps. In the first step, polishing slurry is received at a CMP machine. Next, a polish pad is rotated. Then, the polishing slurry is dispensed onto a portion of said polish pad located proximately around a location designated for holding a wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.