Rigid polishing pad conditioner for chemical mechanical polishing tool
US6409580B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2001 |
| Grant date | Jun 25, 2002 |
| Priority date | — |
| Expiry date | Mar 26, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/017
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention is a method and apparatus for conditioning a polishing pad used for chemically mechanically polishing semiconductor wafers. The conditioning device includes a rigid elongated element that resists bowing or warping during the conditioning process. Abrasive elements are supported by a substantially planar bottom surface of the rigid element. The abrasive elements may have a diamond layer cut into a grid pattern to provide an abrasive surface. The conditioning device is preferably used to condition a polishing pad supported by a rigid platen. The conditioning device is pressed against and swept across the polishing pad by an actuator while the polishing pad is rotated to uniformly condition the polishing pad. This uniform conditioning, while avoiding the bowing and warping of the prior art, provides a superior conditioning process for the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.