Method and apparatus for depositing and controlling the texture of a thin film
US6409904B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 1999 |
| Grant date | Jun 25, 2002 |
| Priority date | — |
| Expiry date | Aug 13, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a method and apparatus for plating a conductive material to a substrate and also modifying the physical properties of a conductive film while the substrate is being plated. The present invention further provides a method and apparatus that plates a conductive material on a workpiece surface in a “proximity” plating manner while a pad type material or other fixed feature is making contact with the workpiece surface in a “cold worked” manner. In this manner, energy stored in the cold worked regions of the plated layer is used to accelerate and enhance micro-structural recovery and growth. Thus, large grain size is obtained in the plated material at a lower annealing temperature and a shorter annealing time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.