Semiconductor device with two stacked chips in one resin body and method of producing
US6410365B1 · kind B1 · utility
15Cited by
12References
4Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 1, 1999 |
| Grant date | Jun 25, 2002 |
| Priority date | — |
| Expiry date | Jun 1, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, includes a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by welding outside the resin body after sealing them with resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.